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1. Field of the Invention

The present invention relates to a semiconductor device.

2. Description of the Related Art

Electronic devices including integrated circuits and capacitors are used in various industrial fields. For example, integrated circuits are used in digital cameras, car navigation systems, portable information devices, television sets, medical devices, industrial robots, and the like. The capacitors are used in power supplies, automobile ignition systems, and the like.

In such electronic devices, the components such as the integrated circuits and the capacitors are mounted on a printed wiring board (a PCB board). The electronic devices use semiconductor devices as the components, and the semiconductor devices are attached to the printed wiring board. A semiconductor chip is connected to a pattern on the printed wiring board via a bump electrode. The semiconductor chip is connected to the printed wiring board via an anisotropic conductive adhesive (ACF) that is formed by dispersing conductive particles in an insulating adhesive, thereby electrically connecting the semiconductor chip and the pattern.

By forming a plurality of bump electrodes in a matrix form on the semiconductor chip, the semiconductor device is generally electrically connected to the printed wiring board with the plurality of bump electrodes in a matrix form.

In such semiconductor devices, the height of each bump electrode is as small as about 1 μm to 2 μm. Furthermore, the heat-curing property of the bump electrode is low, and there is a risk that a part of the bump electrode is peeled off due to heat from the printed wiring board.

There is a technique in which a bump electrode is formed in an island shape to prevent the bump electrode from being peeled off. Japanese Patent Application Laid-Open Publication No. 2006-237778 discloses a technique in which a bump electrode of an island shape is formed on a surface of an integrated circuit (a semiconductor chip). Japanese Patent Application Laid-Open Publication No. 2011-176413 discloses a technique in which a bump electrode of an island shape is formed on a pad electrode formed on a semiconductor substrate.

However, in Japanese Patent Application Laid-Open Publication No. 2006-237778, the bump electrode is formed on a surface of the integrated circuit (the semiconductor chip). As a result, the number of bump electrodes that can be formed in a unit area is small. Furthermore, there is a problem in that the number of bump electrodes is limited by the size of the semiconductor 0b46394aab